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NxGen Electronics, Advanced Packaging Technologies
www.dodgedemonclub.com - 2009-04-03
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UBGA, 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. Tessera ...
global.tessera.com - 2009-04-09
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fine pitch bga
land grid array
ball grid array
csp
for sale
fold-over
bga
integrated passives
abr
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